Date
28 May 2024
Technical talk on “Innovative solutions with LabVIEW for industrial challenges”
Date : 28-05-2024
Venue : 3rd floor Seminar hall
Resource person: Mr.Sunil Kumar V
Managing director, VI solutions
Technical talk on innovative solutions with LabVIEW for core industrial challenges on the date of 28th june 2024.The resource person for the event was Mr. Sunil Kumar V. Mrs.Bharathi Gururaj, HOD of Electronics and communication department welcomed the gathering and introduced the chief guest to the audience.
The program was presided over by the Mr. Sunil Kumar V.He gave a introduction about what is LabVIEW and why it is very much important. He discussed about the importance of LabVIEW. He gave a brief introduction about the LabVIEW
View Event Report
Venue : 3rd floor Seminar hall
Resource person: Mr.Sunil Kumar V
Managing director, VI solutions
Technical talk on innovative solutions with LabVIEW for core industrial challenges on the date of 28th june 2024.The resource person for the event was Mr. Sunil Kumar V. Mrs.Bharathi Gururaj, HOD of Electronics and communication department welcomed the gathering and introduced the chief guest to the audience.
The program was presided over by the Mr. Sunil Kumar V.He gave a introduction about what is LabVIEW and why it is very much important. He discussed about the importance of LabVIEW. He gave a brief introduction about the LabVIEW
View Event Report
Events List
- Webinar on Retrieval Augmented Generation (RAG)
- Workshop on “Accelerators / Incubation Opportunities for Startup Aspirants”
- Conference by Dr. Windhya Rankothge at ACSCON – 2026
- International Expert Session by Dr. Ross Smith at ACSCON – 2026
- “How to Start a Career in AI : A Complete SBS Approach”
- A Review on Outcome Based Education and Factors that Impact Student Learning Outcomes
- Farewell Party 2026
- Industrial Visit to U R Rao Satellite Centre (URSC), ISRO, Bengaluru
- Industrial Visit to BPL Medical Technologies, Bengaluru
- Career Guidance Program on “Opportunities for Aerospace Engineers in Technical Publication”